parts: add ESP32-C3 SuperMini, MLX90640, M12 IO-Link to electronics catalog#513
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w1ne wants to merge 1 commit into
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parts: add ESP32-C3 SuperMini, MLX90640, M12 IO-Link to electronics catalog#513w1ne wants to merge 1 commit into
w1ne wants to merge 1 commit into
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…ctronics catalog Three real CC/OSHW-licensed STEP models for the thermal-fingerprint IO-Link build, fetched at ingest time and merged additively into the kernelcad-parts catalog (never clobbers the FreeCAD mechanical parts or existing electronics): - esp32-c3-supermini (OSHW, mrtnvgr/KiCad_ESP32-C3-SuperMini) - mlx90640 (MIT, Adafruit_CAD_Parts #4469) - m12-iolink-5pin (OSHW, Phoenix Contact via oro-os/link) All three verified locally to parse to >=1 solid with measured bboxes.
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Adds three real CC/OSHW-licensed STEP models to the electronics parts manifest, fetched at ingest time and merged additively into the kernelcad-parts catalog (FreeCAD mechanical parts + existing electronics are untouched).
Parts
esp32-c3-superminimlx90640m12-iolink-5pinThese are the parts for the thermal-fingerprint IO-Link sensor build (C3 SuperMini MCU + MLX90640 thermal cam over I2C + M12 IO-Link interface).
Verification (deployed catalog)
Ran the Parts Catalog workflow off this branch; it rebuilt FreeCAD (2429) + electronics and deployed to
kernelcad-parts.pages.dev. Verified via the deployed MCP (mcp.kernelcad.com)fetch_part:esp32-wroom-32STILL resolves (no regression).All 3 parse to >=1 solid with measured bboxes (esp32-c3-supermini 18x24.02x4.12mm, mlx90640 25.4x17.78x1.57mm, m12-iolink-5pin 20x28.9x16mm).
Merging keeps the parts in the weekly scheduled rebuild from
develop.