feat: full footprinter coverage in Footprinter3d + coverage test - #315
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Dasdebsankar54 wants to merge 2 commits into
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feat: full footprinter coverage in Footprinter3d + coverage test#315Dasdebsankar54 wants to merge 2 commits into
Dasdebsankar54 wants to merge 2 commits into
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Problem - Footprinter3d silently returned null for ~40 of the 97 footprint functions exposed by @tscircuit/footprinter (about 100 models when counting pin/size variants), so components vanished from boards with no error. JST connectors parsed fine but only rendered for the ZH series; SH and PH fell through. Several components already existed in lib/ but were never wired into the switch or exported, and every new footprinter release added more silent gaps. Root cause - No machine-checkable coverage: a null render does not throw, no test enumerated footprinter names, so gaps were invisible and the backlog regrew automatically. 15 component files were not even exported from index.ts. Fix - Add tests/footprinter-coverage.test.ts: iterates all 97 names from fp.getFootprintNames() and asserts each renders non-null, turning the backlog into a self-updating checklist that fails CI when footprinter adds packages. 'pad' and 'vson' are broken upstream in footprinter itself (parser throws) and are pinned by a companion test until fixed there. - New parametric JST component (series zh/sh/ph presets) replacing the ZH-only wiring; legacy jstzh1_5mm strings still work. - 13 new components: JST, SmdDiode (sod110/sod80/sod323w/sod882d/ smbf), DPAK (dpak/to252/d2pak/to263), SOT89, SOT343, Crystal, ElectrolyticCapacitor, Potentiometer, SmdPushButton, LED2835, LED5050, SolderJumper, M2Host. - Wire existing-but-unreachable components: BGA (bga/lga), SOD123, SOT233P (sot23), SOT563, RadialCapacitor (radial), USB_C (usbcmidmount), QFN for quad/mlp/son/vson/wson, SOIC for sop8/ssop, StampBoard for breakoutheaders, FootprintPad/ FootprintPlatedHole for smtpad/pad/platedhole, TO220/TO92 for their f/l/s variants. - Complete index.ts exports for all previously unexported components. - Add Ellipsoid to the vanilla primitive shim (required by USB-C, which previously broke the vanilla bundle once reachable). - 15 cosmos examples for the new models. Verification - bun test: 82/82 pass, including all 73 pre-existing snapshot tests, so existing model output is unchanged (purely additive change). - bun run build succeeds for both index and vanilla entries.
Dasdebsankar54
requested review from
ShiboSoftwareDev,
seveibar and
techmannih
as code owners
July 28, 2026 17:38
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Fixes the Format Check CI failure on PR tscircuit#315: collapse JSX props onto single lines per biome's canonical style in ElectrolyticCapacitor, LED2835, Potentiometer, and Footprinter3d. No behavior change; bun test still 82/82.
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Adds 3D models for ~40 previously-unhandled footprinter functions (incl. JST
SH/PH connectors) and a coverage test that fails CI whenever footprinter
gains an unwired package. 82/82 tests pass; all pre-existing snapshots
unchanged, so existing model output is bit-identical.
Problem
exposed by @tscircuit/footprinter (~100 models counting pin/size variants).
JST connectors parsed fine but only rendered for the ZH series; SH/PH fell
through. Several components existed in lib/ but were never wired/exported.
Fix
asserts non-null renders — self-updating checklist, fails CI on new gaps
ElectrolyticCapacitor, Potentiometer, SmdPushButton, LED2835/5050,
SolderJumper, M2Host, JST)
RadialCapacitor, USB_C, QFN/SOIC/StampBoard reuse) + completed index.ts
exports
Verification