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InkTime Smartwatch - Project Documentation

Author: BADEA Stefan-Vasile

License: GNU GPLv3


1. System Architecture & Block Diagram

The system architecture centers on the nRF52840 SoC, which handles wireless connectivity and peripheral management. Power delivery is optimized via an RT6160 Buck-Boost converter to ensure a stable 3.3V supply.

Block Diagram


2. Bill of Materials (BOM)

Component JLC Part # Package Description Datasheet
SJ1 N/A Solder Jumper (Copper feature - leave open) SMD solder JUMPER N/A
R2, R3, R4 C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
C23, C27, C34, C42 C21012218 - Check availability datasheet
EPD_C5 C9900156064 201 Generic chip capacitor datasheet
R1_EP_DR C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
C15 C9900156064 201 Generic chip capacitor datasheet
C5, C7, C8, C12, C19 C9900156064 201 Generic chip capacitor datasheet
C11 C9900156064 201 Generic chip capacitor datasheet
R2_EP_DR, R9, R_PWR_EPD C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
R5, R7, R8 C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
C1-EP-DR C9900156064 201 Generic chip capacitor datasheet
C24, C39 C9900179830 402 0402 (1005 Metric) N/A
L2 C12669 402 Generic chip inductor datasheet
C1, C2, C17, C18 C9900156064 201 Generic chip capacitor datasheet
L3 C12669 402 Generic chip inductor datasheet
C3, C4 C9900156064 201 Generic chip capacitor datasheet
C29, C30, C31, C32, C37, C38 C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
EPD_C1, EPD_C2, EPD_C6, EPD_C7, EPD_C8, EPD_C9, EPD_C10, EPD_C11, EPD_C12 C9900156064 201 Generic chip capacitor datasheet
R_TYPE_SEL C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
SW_DN, SW_ENT, SW_UP C569760 SMD,3.9x2.9mm -40℃~+85℃ 1.6N 1.6mm 15V 2.9mm 20mA 3.9mm 500,000 Cycles IP67 J-Lead Rectangular Button SPST Surface Mount,Vertical White With Bracket SMD,3.9x2.9mm Tactile Switches ROHS datasheet
Q1 C2564 TO-220AB -55℃~+175℃ 1 P-Channel 180nC@10V 200W 20mΩ@10V 3.4nF 4V 55V 640pF 74A P-Channel TO-220AB MOSFETs ROHS datasheet
C25, C33 C9900179830 402 0402 (1005 Metric) N/A
ANT1 C2917717 1206 -45℃~+125℃ 0.5dBi 1.3mm 1.6mm 100MHz 2.45GHz 2W 3.2mm 50Ω Patch Antenna 1206 Antennas ROHS datasheet
L1 C12669 402 Generic chip inductor datasheet
X2 C32346 SMD3215-2P -40℃~+85℃ 12.5pF 32.768kHz 70kΩ Crystal Oscillator ±20ppm SMD3215-2P Crystals ROHS datasheet
X1 C9009 SMD3225-4P -40℃~+85℃ 12pF 32MHz Crystal Oscillator ±10ppm ±20ppm SMD3225-4P Crystals ROHS datasheet
R17, R18 C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
C43 C9900156064 201 Generic chip capacitor datasheet
C2-EP-DR C9900156064 201 Generic chip capacitor datasheet
C6, C14, C20, C21 C9900156064 201 Generic chip capacitor datasheet
C16 C9900156064 201 Generic chip capacitor datasheet
J1 C122434 SMD,P=0.5mm,Surface Mount,Right Angle FFC & FPC Connectors 0.5mm FPC RA SMT Dual Contact 24Ckt datasheet
R1_USB, R2_USB C3920633 0201 7.68k 0201 Thin Film Surface Mount Fixed Resistor +/-0.5% 0.031W CPF0201D7K68C1 datasheet
L5 C1329646 SMD,4.8x4.8mm 1.6A 1.6A 4.7uH 41.4mΩ AEC-Q200 ±30% SMD,4.8x4.8mm Power Inductors ROHS datasheet
C9 C9900156064 201 Generic chip capacitor datasheet
IC3 C189517 LGA-12(2x2) Accelerometers Triaxial low-g 12bit Acceleration Sensor datasheet
IC1 C3682423 DSBGA-8(1.1x1.6) Charger IC Lithium Ion/Polymer, Lithium Iron Phosphate 8-DSBGA (1.6x1.1) datasheet
IC2 C81079 DSBGA-9 Haptic Driver for ERM/LRA with Built-In Library and Smart Loop Architecture datasheet
L7 C5832368 1008 13mΩ 470nH 6.5A 7.5A ±20% 1008 Power Inductors ROHS datasheet
TP (Test Pads) N/A N/A Test pad N/A
J4 C709357 SMD -40℃~+85℃ 1 10,000 cycles 16P 30V 3A 7.81mm Female Surface Mount, Right Angle Type-C SMD USB Connectors ROHS datasheet
U2 C2682616 DFN-8-EP(2x2) -40℃~+85℃ 1 2.5V~4.5V 3uA I2C Lithium Battery DFN-8-EP(2x2) Battery Management ROHS datasheet
D2, D4, D5 C82046 SOD-123 ON SEMICONDUCTOR - MBR0530 - DIODE, SCHOTTKY, 0.5A, 30V, SOD-123 datasheet
C10, C13, C22 C9900156064 201 Generic chip capacitor datasheet
U1 C3606653 QFN-48(6x6) nRF52840 datasheet
IC9 C7065276 WLCSP-15B(2.3x1.4) Buck-Boost Regulator Positive Output Step-Up/Step-Down I2C DC-DC Controller IC 15-WL-CSP (BSC) (1.4x2.3) datasheet
Q3 C469327 SOT-323 MOSFET N-Ch 30V 1.5A TrenchFET SC70 Vishay Si1308EDL-T1-GE3 N-channel MOSFET Transistor, 1.5 A, 30 V, 3-Pin SC-70 datasheet
J2 C90533 P=1mm CABLE ADAPTER 6 POS datasheet
D3 C2969755 SOT-23-6L Low Cap. ESD Protection Auto SOT-23-6 STMicroelectronics USBLC6-2SC6Y, Dual Uni-Directional TVS Diode Array, 6-Pin SOT-23 datasheet

3. Hardware Functionality & Technical Specifications

The InkTime Smartwatch project is designed as an ultra-low-power wearable platform, designed for extended battery life and a visual interface that remains readable in any lighting conditions thanks to the E-Ink display.

3.1. Central Processing Unit (SoC)

The core of the device is the Nordic Semiconductor nRF52840 SoC, selected for its great balance between high performance and ultra-low power consumption:

  • Processor: ARM Cortex-M4F running at 64 MHz, capable of handling complex sensor signal processing algorithms.
  • Connectivity: Native support for Bluetooth 5.4 Low Energy (BLE), essential for smartphone connection.
  • Efficiency: Features an advanced power management system with "Deep Sleep" modes drawing currents in the micro-amp range ($\mu A$).

3.2. Power Management (PMIC)

  • Charging: The BQ25180 chip manages the charging cycle via USB-C using the Constant Current/Constant Voltage (CC/CV) method, providing overvoltage protection and temperature monitoring.
  • Buck-Boost Regulation: The watch uses the RT6160 converter. Unlike a classic LDO regulator, this Buck-Boost converter maintains a stable 3.3V output even when the battery voltage drops below this threshold (down to 3.0V), thereby extracting the maximum energy from the battery cell.
  • Monitoring: The MAX17048G (Fuel Gauge) chip reports the battery's state of charge with high precision via the I2C interface.

3.3. Sensors and Communication Interfaces

The device uses two primary digital interfaces to communicate with its peripherals:

  • I2C Bus (SDA/SCL): This shared bus connects most of the system's smart peripherals, significantly reducing PCB complexity. It includes the BMA423 triaxial accelerometer (for step counting), the MAX17048G fuel gauge (for precise battery monitoring), and the DRV2605YZFR haptic driver.
  • SPI Bus (SCK/MOSI/CS): Dedicated to the E-Paper display via the 24-pin FPC connector (J1). SPI was chosen to handle the high-bandwidth image data required for screen updates while maintaining low power consumption.
  • Haptic Feedback: The DRV2605YZFR driver controls the vibration motor via PWM (Pulse Width Modulation), providing silent and customizable haptic alerts to the user.

3.4. Energy Consumption Estimations

The system is powered by a 250 mAh Polymer Lithium-Ion battery (Akyga LP502030). Thanks to the E-Ink display, which only draws power during image updates, the autonomy has been estimated as follows:

Estimated Average Current ($I_{avg}$):

  • Sleep Mode (MCU + BLE): $\approx 35\text{ µA}$
  • Sensor Polling (Active): $\approx 120\text{ µA}$
  • Display Refresh (average/minute): $\approx 25\text{ µA}$
  • Total Average Current: $I_{avg} \approx 180\text{ µA} = 0.18\text{ mA}$

Theoretical Autonomy ($T$): $$T = \frac{Capacity}{I_{avg}} = \frac{250\text{ mAh}}{0.18\text{ mA}} \approx 1389\text{ hours}$$

Real-world Autonomy: Under typical operating conditions (including BLE advertising, sensor fusion, and haptic notifications), the estimated autonomy is approximately 9 - 14 days.


4. Microcontroller Pinout (nRF52840 Mapping)

4.1. Pin Assignment

Component Signal nRF Pin Direction Technical Justification
E-Ink Display SPI SCK P0.11 Output High-speed clock pin for the SPI bus.
E-Ink Display SPI MOSI P0.12 Output Transfers image data to the display.
E-Ink Display SPI CS P0.13 Output Active-low Chip Select control.
E-Ink Display Data/Command P0.14 Output Distinguishes between command and data transmissions.
E-Ink Display Reset P0.15 Output Hardware reset required for display initialization.
E-Ink Display Busy P0.16 Input Monitors internal display status (refresh in progress).
I2C Sensors SDA P0.26 I/O Shared data line.
I2C Sensors SCL P0.27 Output Synchronous clock line for the I2C bus.
Button (Up) GPIO P1.07 Input Digital input on Port 1, isolated from high-speed data.
Button (Enter) GPIO P1.08 Input Digital input with internal pull-up enabled.
Button (Down) GPIO P1.09 Input UI navigation.
Haptic Motor PWM P1.02 Output Vibration intensity control via pulse-width modulation.
Power Management DC/DC EN P0.18 Output Enable pin for the RT6160 (shutdown in deep-sleep).
IMU Sensor INT1 P0.25 Input Hardware interrupt for the "double-tap" feature.

4.2. Design Details and Decisions

Port Optimization (Port 0 vs. Port 1)

The watch uses the Port 0 for peripherals requiring high data transfer rates (SPI and I2C). This decision enables the use of the nRF52840’s EasyDMA features, significantly reducing CPU load during image transfers to the display or during sensor data acquisition.

E-Ink display SPI Interface

Pins P0.11 - P0.16 were physically grouped on a single side of the microcontroller. This grouping facilitates a compact SPI bus layout, reducing trace length and impedance, which ensures signal integrity even at high clock frequencies.

Sensor Management (I2C)

The standard pins P0.26 and P0.27 are used for the I2C bus, as they are internally optimized for low power consumption and feature excellent hardware support within the Zephyr RTOS and Nordic SDK. All smart peripherals — the BMA423 IMU, the MAX17048G Fuel Gauge, and the DRV2605YZFR Haptic Driver—are connected in parallel on this shared bus to conserve GPIO pins and simplify PCB routing.

Button Isolation on Port 1

By placing the user buttons on Port 1 (P1.07-P1.09), we ensured a physical separation at the layout level between the high-speed switching digital signals (SPI/I2C) and the sensitive button inputs. This design practice prevents "ghosting" or accidental triggers caused by electromagnetic noise on the PCB.

NFC Considerations (P0.09 / P0.10)

We avoided using pins P0.09 and P0.10 for buttons or sensors, despite their availability. These pins are dedicated to NFC functionality and have a different internal capacitance compared to standard GPIOs. Keeping them unassigned allows for the addition of an NFC antenna in future product iterations without requiring a complete pinout redesign.


5. Design Log & Engineering Decisions

5.1. PCB Layout Challenges

  • 0201 Package Constraint: The use of 0201 passive components was necessary to allow the routing of all 49 components on a single layer (TOP), adhering to the extremely compact dimensions of the enclosure.
  • Antenna Management: The chip antenna area was kept clear of ground planes on all layers (Keep-out zone) to ensure optimal Bluetooth range, in accordance with the manufacturer's specifications.
  • Power Traces: Power supply rails (VCC, 3V3, VBAT) were routed with a width of 0.3mm, while data signals were set to 0.15mm, ensuring minimal voltage drop on high-current lines.

5.2. Signal Integrity and Decoupling

  • 100nF decoupling capacitors were placed at a maximum distance of 0.5mm from the nRF52840 power pins to effectively filter high-frequency noise.
  • Via Stitching was employed to tie the Top and Bottom ground planes (GND) together, thereby reducing the reference plane impedance and improving overall RF performance.

6. 3D Renderings

Final look InkTime Smartwatch

Final look

PCB Top View

PCB Render

Exploded View

Exploded View

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An open-source smartwatch project featuring a custom PCB layout and a fully integrated 3D mechanical enclosure.

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