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Releases: Yoder23/aethermor

v1.0.1 — Peer Review Response

01 Apr 02:05
@Yoder23 Yoder23
v1.0.1
effb91a

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v1.0.1 — Peer Review Response Latest
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Changes in v1.0.1

Structural Refactoring

  • All modules moved under aethermor/ namespace (aethermor.physics, aethermor.analysis, etc.)
  • Removed all 20 sys.path.insert hacks
  • Split monolithic app.py (730 lines) into modular aethermor/app/ (6 tab modules)
  • CLI entry point: aethermor dashboard, aethermor validate, aethermor version
  • python -m aethermor support

New Documentation

  • Calibration case study: 15 real production chips validated against datasheet Tj_max
  • Datacenter GPU case study: 8-GPU node cooling decision matrix
  • Uncertainty/sensitivity analysis: Monte Carlo propagation, OAT sensitivity, transient roadmap

README Enhancements

  • Start Here evaluation guide for thermal engineers
  • Validation summary table with error bounds
  • When This Model Breaks — failure modes table
  • CFD comparison table (Aethermor vs COMSOL/Icepak/FloTHERM)
  • Academic references (Incropera, CRC, ITRS/IRDS, CODATA, Carslaw & Jaeger)

Consistency Audit

  • All test counts, import paths, and module references updated across docs
  • 277 tests passing, 680+ validation checks
Assets 4
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Aethermor v1.0.0 - Production-Ready Thermal Engineering Toolkit

25 Mar 15:39
@Yoder23 Yoder23
v1.0.0
6774967

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Aethermor v1.0.0 - Production-Ready Thermal Engineering Toolkit

Aethermor v1.0.0

Production-ready open-source toolkit for chip thermal analysis, cooling tradeoffs, and compute-density optimization.

Validation: 680+ Checks, All Passing

Suite Checks Scope
Unit + integration tests 278 Full API coverage
Physics validation 133 CODATA, CRC Handbook, ITRS/IRDS, analytical solutions
Chip thermal database 82 12 production chips (A100, H100, MI300X, EPYC, Xeon, i9, Ryzen, M1, M2, Snapdragon, etc.)
Material cross-validation 93 9 materials vs CRC, ASM, NIST, Ioffe, manufacturer data
Real-world chip validation 33 NVIDIA A100, Apple M1, AMD EPYC 9654, Intel i9-13900K
Experimental measurements 18 JEDEC theta_jc, IR thermal imaging, HotSpot benchmarks
Literature validation 20 Textbook solutions, published reference data
Engineering case studies 23+ Datacenter cooling, mobile SoC, substrate selection

Key Capabilities

  • Inverse thermal design: Find max compute density, min cooling, optimal power distribution
  • 9 substrate materials with extensible registry (Si, SiO2, GaAs, Diamond, Graphene, Cu, InP, SiC, GaN)
  • 4 computing paradigms: CMOS, adiabatic, reversible, Landauer limit
  • 3D Fourier thermal solver with 0.00% energy conservation error
  • Technology roadmap: 130 nm to 1.4 nm projections
  • Interactive dashboard: 6-tab explorer with live-updating charts

Install

pip install https://github.com/Yoder23/aethermor/releases/download/v1.0.0/aethermor-1.0.0-py3-none-any.whl

Verify

python run_all_validations.py   # 12 suites, 680+ checks, ~3 minutes
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